JPH0710517Y2 - 混成集積回路 - Google Patents
混成集積回路Info
- Publication number
- JPH0710517Y2 JPH0710517Y2 JP1989090551U JP9055189U JPH0710517Y2 JP H0710517 Y2 JPH0710517 Y2 JP H0710517Y2 JP 1989090551 U JP1989090551 U JP 1989090551U JP 9055189 U JP9055189 U JP 9055189U JP H0710517 Y2 JPH0710517 Y2 JP H0710517Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- terminals
- terminal
- dil
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 29
- 230000009977 dual effect Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000005476 soldering Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989090551U JPH0710517Y2 (ja) | 1989-08-01 | 1989-08-01 | 混成集積回路 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989090551U JPH0710517Y2 (ja) | 1989-08-01 | 1989-08-01 | 混成集積回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0330457U JPH0330457U (en]) | 1991-03-26 |
JPH0710517Y2 true JPH0710517Y2 (ja) | 1995-03-08 |
Family
ID=31640068
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989090551U Expired - Lifetime JPH0710517Y2 (ja) | 1989-08-01 | 1989-08-01 | 混成集積回路 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0710517Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009233297A (ja) * | 2008-03-25 | 2009-10-15 | Akira Okada | 干し回る君 |
-
1989
- 1989-08-01 JP JP1989090551U patent/JPH0710517Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0330457U (en]) | 1991-03-26 |
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